Microsemi Shanghai (SMSC), a wholly owned subsidiary of Microsemi Corporation, offers Bridges, Voltage Suppressors and UF/SF Diodes that can be electrically equivalent to JEDEC registration as well as customer specified special requirements. SMSC's chip processing is engineered by Microsemi Corporation who has over 20 years of experience in manufacturing discrete semiconductor products for military applications. Planar chips which are thermal silicon oxide passivated and are primarily common cathodes (backside) in chip mounting configuration. The Mesa chips are multiple-layer passivated and can be obtained in either common anode or cathode (backside) in chip configuration.